Tour Package Management
Product Description
Abstract—A novel double diode package (footprint D2PAK compatible) was designed, simulated, and fabricated using an innovative embedding process with electroplated large-area copper contact metallizations on both sides of the chip. The package was also experimentally characterized regarding the thermal performance using two different test methods: < Final Year Projects > a test board and testing procedure according to a JEDEC standard and a high-power test stand where the package in question is soldered to a copper block (ideal cooling). Using both methods the performance of the new package was compared to a standard D2PAK containing the same power diode chip. Along with this first experimental study further improvements of the package design were investigated by FEM simulation.
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